więcej - Instytut Technologii Elektronowej

Instytut Technologii Elektronowej
Al. Lotników 32/46, 02-668 Warszawa
Department of Integrated Circuits and Systems
Division of Silicon Microsystems and Nanostructure Technology
Department of Semiconductor Sensors
3 D Integrated Micro/Nano Modules
For Easily Adapted Application
Akronim: e-CUBES
Contract No. 026461
http://ecubes.epfl.ch
/public/
http://ecubes.epfl.ch/
public/
OUR ROLE
IN THE PROJECT
COORDINATOR
• Dr. Werner Weber, Infineon
PARTICIPANTS
Modeling and simulation of vertical integration effects
(electrical, thermal, mechanical) for signal integrity and timing
• Infineon, Munich, Germany
analysis to ensure optimal system behaviour.
• Alcatel Alenia Space, Toulouse, France
• Honeywell Romania, Bucharest, Romania
PROJECT DESCRIPTION
• Philips, Eindhoven, Netherlands
The subject of the project is the design and integration of 3-
• Philips Research, Aachen, Germany
dimensional microelectronic systems (e-Cubes) consisting of sensor,
• SensoNor, Horten, Norway
processing, radio and power unit.
• Sintef, Oslo, Norway
3-D integration technology reduces size and length of interconnections,
• 3D Plus, Buc, France
increasing the packaging denisity, posting at the same time difficult
• Thales, Elancourt, France
challenges
• CEA, Grenoble, France
electromagnetical interfrence, electro-thermal and thermo-mechanical
• FhG, Munich, Germany
behaviour.
• Infineon, Graz, Austria
related
to
process
and
material
integration,
• IMEC, Leuven, Belgium
• Tyndall, Cork, Ireland
All these aspects are to be
• EPFL, Lausanne, Switzerland
process
• TU Berlin, Berlin, Germany
Multilevel and multidomain modeling and simulation is the tool fulfilling
• Uni Paderborn, Paderborn, Germany
these requirements.
• Uppsala University, Uppsala, Sweden
of
functionally
and
taken into consideration in the design
technologically
diverse
subsystems.
The e-Cubes concept will be proven in:
• PITS, Leuven, Belgium
•intelligent monitoring systems in space research
• Philips Design, Eindhoven, Netherlands
•wireless sensor networks for health
• Instytut Technologii Elektronowej, Warszawa, Poland
•complex sensor networks for automotive applications.
RESULTS
Example of FEM analysis
temperature
Electronic
sensor
Interface
& amplif.
External
stimulus
heat
heat
thermal analysis
Signal
processing
RF
thermo-mechanical
analysis
-
heat
Mech.
stress
Power
supply
Mechanical
force
Contact person: Jerzy Szynka
phone: +48 22 5487850, [email protected]