Pasty bezołowiowe

TM
ECOREL FREE 305-2
TM
ECOREL FREE 405-2
LEAD FREE no-clean solder paste
PERFORMANCES
ECORELTM FREE 305-2 & ECORELTM FREE 405-2- SnAgCu solder pastes have been developed in order to offer high
printing capability :
excellent abandon time - steady tackiness during several days.
Wetting is very good in a large thermal process window . The outstanding nature of its organic part allows residue fully
compatible with pin point test.
SPECIFICATIONS
ECOREL FREE
305-2
405-2
Alloy (available with others Ag content)
Powder size distribution (microns)
Melting point (°C)
Metal content (%)
Halogen content
Viscosity* (Pa.s 20°C)
SnAg3Cu0,5
25 - 45
217
88 +/- 0,5
No halogen
800 - 1000
SnAg4Cu0,5
25 - 45
217
88 +/- 0,5
No halogen
800 - 1000
*Brookfield RVT - TF at 5 rpm.
CHARACTERISTICS
Stencil life over 12 hours
Abandon time over 4 hours
(0.4 mm pitch, stencil 120 Microns)
More than 16 hours of steady
tackiness
High first pass yield at ICT
fine pitch printing
6
Printing speed
Residue cleanliness
Pin point test-ability
4
stencil life
2
Residue cosmetics
abandon time
0
cold slump
Tombstoning
Wettability
Wide thermal process
window
Steady tackiness
hot slump
FUNCTIONAL TESTS
Results
Procedures
Flux Classification
L0
F-SW 32
113
pass
pass
pass
pass
pass
ANSI/J-STD-004
DIN 8511
ISO 9454
ANSI/J-STD-005
ANSI/J-STD-004
ANSI/J-STD-004
ANSI/J-STD-004
ANSI/J-STD-004
Solder balling test
Copper mirror
Chromate paper
Copper corrosion
Surface Insulation Resistance Ohms
After 7 days
85°C - 85 % RH - 50 Volts
25°C - 65 % RH
10
> 10
> 1012
www.avantec.dehon.com
TM
ECOREL FREE 305-2
TM
ECOREL FREE 405-2
PACKAGING
Jar
Cartridge
PROFLOW Cassette
250 g or 500 g
600 g or 1200 g
700 g
STORAGE & SHELF LIFE
To ensure the best product performance, the recommended storage temperature range is from 5°C to 10°C.
A shelf life of 9 months is achieved under these conditions. For cartridges, shelf life is 6 months.
CONDITIONS OF USE
SOLDER PASTE PREPARATION
Before printing, it’s essential to properly mix the solder paste, either manually with a spatula, or by doing
several preliminary prints on the stencil.
PRINTING
Apply about 2 cm bead diameter solder paste to allow for a smooth even roll during the printing process, generally 100
g per 10 cm squeegee length.
squeegee speed : 50 to150 mm/sec
Pressure depends upon print squeegee speed. Higher print speed requires higher squeegee pressure.
Minimum pitch 0,3 mm.
300
REFLOW THERMAL PROFILE
Even though short & linear profile is
recommended EcorelTM Free 305-2 &
EcorelTM Free 405-2 withstand profile with
soak zone within the 2 curves.
Reflow Profile
250
217°C
200
150
CLEANING
These no-clean solder pastes EcorelTM
Free 305-2 & EcorelTM Free 405-2 can be
cleaned with recommended Avantec
cleaning solution.
100
TM
ECOREL FREE 305-2
TM
ECOREL FREE 405-2
50
0
0
50
100
150
200
250
300
350
seconds
HSE
Please refer to MSDS before use.
The information given herewith is designed only as a guidance and is not to be considered warranty of AVANTEC. REV#0 10/02/04
FPCGB SB 10000 000 -
4, Jalan P/17, Selaman Industrial Park
43650 Bandar Baru Bangi, Selangor, Malaysia
Tel + 603 89 26 38 55
Fax + 603 89 26 38 78