więcej - Instytut Technologii Elektronowej
Transkrypt
więcej - Instytut Technologii Elektronowej
Instytut Technologii Elektronowej Al. Lotników 32/46, 02-668 Warszawa Department of Integrated Circuits and Systems Division of Silicon Microsystems and Nanostructure Technology Department of Semiconductor Sensors 3 D Integrated Micro/Nano Modules For Easily Adapted Application Akronim: e-CUBES Contract No. 026461 http://ecubes.epfl.ch /public/ http://ecubes.epfl.ch/ public/ OUR ROLE IN THE PROJECT COORDINATOR • Dr. Werner Weber, Infineon PARTICIPANTS Modeling and simulation of vertical integration effects (electrical, thermal, mechanical) for signal integrity and timing • Infineon, Munich, Germany analysis to ensure optimal system behaviour. • Alcatel Alenia Space, Toulouse, France • Honeywell Romania, Bucharest, Romania PROJECT DESCRIPTION • Philips, Eindhoven, Netherlands The subject of the project is the design and integration of 3- • Philips Research, Aachen, Germany dimensional microelectronic systems (e-Cubes) consisting of sensor, • SensoNor, Horten, Norway processing, radio and power unit. • Sintef, Oslo, Norway 3-D integration technology reduces size and length of interconnections, • 3D Plus, Buc, France increasing the packaging denisity, posting at the same time difficult • Thales, Elancourt, France challenges • CEA, Grenoble, France electromagnetical interfrence, electro-thermal and thermo-mechanical • FhG, Munich, Germany behaviour. • Infineon, Graz, Austria related to process and material integration, • IMEC, Leuven, Belgium • Tyndall, Cork, Ireland All these aspects are to be • EPFL, Lausanne, Switzerland process • TU Berlin, Berlin, Germany Multilevel and multidomain modeling and simulation is the tool fulfilling • Uni Paderborn, Paderborn, Germany these requirements. • Uppsala University, Uppsala, Sweden of functionally and taken into consideration in the design technologically diverse subsystems. The e-Cubes concept will be proven in: • PITS, Leuven, Belgium •intelligent monitoring systems in space research • Philips Design, Eindhoven, Netherlands •wireless sensor networks for health • Instytut Technologii Elektronowej, Warszawa, Poland •complex sensor networks for automotive applications. RESULTS Example of FEM analysis temperature Electronic sensor Interface & amplif. External stimulus heat heat thermal analysis Signal processing RF thermo-mechanical analysis - heat Mech. stress Power supply Mechanical force Contact person: Jerzy Szynka phone: +48 22 5487850, [email protected]