poland - EMPC 2017

POLAND
WHERE WEST MEETS EAST
21ST EUROPEAN
MICROELECTRONICS AND PACKAGING
CONFERENCE (EMPC) & EXHIBITION
CALL FOR ABSTRACTS
The 2017 European Microelectronics
and Packaging Conference (EMPC)
will be held for the first time in Poland,
at Warsaw University of Technology
on September 10th to 13th
Sunday – Wednesday.
The conference will include
a plenary session, parallel symposia
and will be accompanied
by thematic exhibition.
ABSTRACT DEADLINE: MARCH 31ST 2017
WWW.EMPC2017.PL
[email protected]
Sponsored by
Cosponsored by
L
W
W
W
.E
M
PC
20
17
.P
We kindly invite you to join the EMPC 2017 which will be held
at Warsaw University of Technology, the greatest technical
university in Poland, where Prof. Jan Czochralski worked. The
place is located in the city center close to the airport, railway
station and surrounded by many hotels.
The conference will be accompanied by a thematic exhibition.
The aim of the EMPC 2017 is to create new dialogues between
international researchers and industrial partners.
The conference is an important platform for dialogue between industry and academia. Don’t miss the opportunity to meet
international experts and exchange experience, gain ideas and cutting edge information of microelectronics, photonics
and packaging industries at EMPC 2017.
EMPC 2017 COMMITTEE
General Chair – Dr. Małgorzata Jakubowska
General Co-Chair – Dr. Jerzy Potencki
Technical Program Chair – Dr. Andrzej Dziedzic
Technical Program Co-Chair – Dr. Piotr Jasiński
Exhibition Chair – Paul Collander
Exhibition Co-Chair – Katarzyna Piekarska
Executive Chair – Dr. Marcin Słoma
Finance Chair – Dr. Agata Skwarek
Media and Promotion Chair – Dr. Grzegorz Wróblewski
Advertising and Promotion Support – Martina Creutzfeldt
Secretary of the Conference – Dr. Dariusz Klepacki
CONFERENCE AND EXHIBITION WILL BE HELD AT THE
MAIN CAMPUS OF THE WARSAW UNIVERSITY OF TECHNOLOGY
1 PLAC POLITECHNIKI – WARSAW, POLAND
March 31st 2017 – Deadline for abstract submition.
Those wishing to present either a paper or a poster at the European Microelectronics and Packaging
Conference 2017 must submit a 200–300 word abstract electronically.
Please visit https://www.conftool.net/empc2017/ to set up an accout and upload your Abstract.
June 30th 2017 – Deadline for paper submition.
A copy of the full paper should be submitted to be included in the event Proceedings and databases.
ABSTRACTS ARE BEING REQUESTED IN THE FOLLOWING AREAS:
Advanced packaging and interconnects
Electronics and photonics components, assembly, circuit and subsystem solutions
Materials and processes
Printed, hybrid and flexible electronics
Modeling, design test & reliability
Functional systems (actuators, sensors, photovoltaics and related)
All submitted abstracts must represent original, previously unpublished work.
We look forward to welcome you to an inspiring and stimulating event.
ORGANIZED BY
IMAPS-Poland
and Warsaw University
of Technology
Sponsored by
Cosponsored by