S16MD01/S16MD02 S26MD01/S26MD02

S16MD01/S16MD02/S26MD01/S26MD02
S16MD01/S16MD02
S26MD01/S26MD02
8-Pin DIP Type SSR for Low
Power Control
■ Features
■ Outline Dimensions
1. Compact 8-pin dual-in-line package type
2. RMS ON-state current IT : 0.6Arms
3. Built-in zero-cross circuit
(S16MD02 / S26MD02 )
4. High repetitive peak OFF-state voltage
S16MD01 / S16MD02 VDRM : MIN. 400V
S26MD01 / S26MD02 VDRM : MIN. 600V
5. Isolation voltage between input and output
( Viso : 4,000Vrms )
6. Recognized by UL, file No. E94758
7. Approved by CSA No. LR63705
Internal connection Diagram
8
1
5
2
3
4
2.54 ± 0.25
8
6
5
2
3
4
9.66
± 0.5
6.5 ± 0.5
A
Anode
mark
S16MD01
S26MD01
S16MD02
S26MD02
3.4 ± 0.5
For 200V lines
A (Model No.)
S16MD01
S16MD02
S26MD01
S26MD02
7.62 ± 0.3
0.5 ± 0.1
0.26 ± 0.1
θ : 0 to 13˚
θ
❈ Zero-cross circuit for S16MD02 and S26MD02
Terminal 1 , 3 and 4 are common ones of cathode.
To radiate the heat, solder all of the lead pins
on the pattern of PWB.
■ Absolute Maximum Ratings
Parameter
Forward current
Input
Reverse voltage
RMS ON-state current
*1
Peak one cycle surge current
Output
S16MD01 / S16MD02
Repetitive peak OFFstate voltage
S26MD01 / S26MD02
*2
Isolation voltage
Operating temperature
Storage temperature
*3
Soldering temperature
Cathode
Anode
Cathode
Cathode
G
T1
T2
1.2 ± 0.3
3.1 ± 0.5
■ Model Line-ups
1
2
3
4
5
6
8
0.5TYP. 3.5 ± 0.5
1
1. Oil fan heaters
2. Microwave ovens
3. Refrigerators
No built-in zerocross circuit
Built-in zerocross circuit
6
❈
Zero-cross
circuit
■ Applications
For 100V lines
( Unit : mm )
( Ta = 25 ˚C)
Symbol
IF
VR
IT
I surge
V DRM
V iso
T opr
T stg
T sol
Rating
50
6
0.6
6
400
600
4 000
- 25 to + 80
- 40 to + 125
260
Unit
mA
V
A rms
A
V
V
V rms
˚C
˚C
˚C
*1 50Hz sine wave
*2 AC for 1 minute, 40 to 60% RH, f = 60Hz
*3 For 10 seconds
“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”
S16MD01/S16MD02/S26MD01/S26MD02
■ Electrical Characteristics
Input
Output
Transfer
characteristics
( Ta = 25˚C )
Parameter
Forward voltage
Reverse current
Repetitive peak OFF-state current
ON-state voltage
Holding current
Critical rate of rise of OFF-state voltage
S16MD02
Zero-cross voltage
S26MD02
Minimum trigger current
Isolation resistance
S16MD01
S26MD01
Turn-on time
S16MD02
S26MD02
Symbol
VF
IR
I DRM
VT
IH
dV/dt
Vox
I FT
R ISO
t on
Fig. 1 RMS ON-state Current vs.
Ambient Temperature
Conditions
I F = 20mA
V R = 3V
V DRM = Rated
I T = 0.6A
V D = 6V
V DRM = ( 1/ 2 ) • Rated
Resistance load
I F = 15mA
V D = 6V, R L = 100 Ω
DC500V, 40 to 60 % RH
V D = 6V, R
I F = 20mA
L
= 100 Ω
Forward current I F ( mA )
RMS ON-state current I F ( Arms )
Unit
V
µA
µA
V
mA
V/µ s
-
-
35
V
5 x 1010
1011
10
-
mA
Ω
-
-
100
µs
-
-
50
µs
50
0.6
0.5
0.4
0.3
0.2
40
30
20
10
0.1
0
25
40 50
Ambient temperature T
a
75 80
( ˚C )
Minimum trigger current I FT ( mA )
50
20
10
5
2
0.5
1.0
1.5
2.0
2.5
Forward voltage V F ( V )
25
50 55
75 80
Ambient temperature T a ( ˚C )
100
12
- 25˚C
Ta =- 25
˚C
100
0
Fig. 4 Minimum Trigger Current vs.
Ambient Temperature
( S16MD01/S16MD02 )
50˚C
25˚C
0˚C
200
0
- 25
100
Fig. 3 Forward Current vs.
Forward Voltage
Forward current I F ( mA )
MAX.
1.4
10
100
3.0
25
-
60
0.7
1
0
TYP.
1.2
-
Fig. 2 Forward Current vs.
Ambient Temperature
0.8
0
- 25
MIN.
100
3.0
VD = 6V
RL= 100 Ω
10
8
6
S16MD01
S16MD02
4
2
0
- 30
0
20
40
60
80
Ambient temperature T a ( ˚C )
100
S16MD01/S16MD02/S26MD01/S26MD02
Fig. 5 Minimum Trigger Current vs.
Ambient Temperature
( S26MD01/ S26MD02)
10
RL= 100 Ω
S26MD01
6
S26MD02
4
2
1.2
1.1
1.0
0.9
0
20
40
60
80
Ambient temperature T a ( ˚C )
0.8
- 30
100
Fig. 7 Relative Holding Current vs.
Ambient Temperature
0
20
40
60
80
Ambient temperature T a ( ˚C )
100
Fig. 8 ON-state Current vs.
ON-state Voltage
1.2
I F = 20mA
T a = 25˚C
V D = 6V
103
ON-state current I T ( mA )
1.0
102
0.8
0.6
0.4
0.2
101
- 30
0
20
40
60
80
Ambient temperature T a ( ˚C )
0
0
100
Fig. 9 Turn-on Time vs. Forward Current
( S16MD01)
0.5
1.0
ON-state voltage V T ( V )
1.5
Fig.10 Turn-on Time vs. Forward Current
(S26MD01 )
200
100
VD = 6V
RL= 100Ω
T a = 25˚C
VD = 6V
RL= 100Ω
T a = 25˚C
Turn-ON time t on ( m s )
Turn-ON time t on ( µ s )
I T = 0.6A
1.3
8
0
- 30
Relative holding current I H ( t˚C ) / I H ( 25˚C ) x 100%
1.4
VD = 6V
ON-state voltage VT ( V )
Minimum trigger current I FT ( mA )
12
Fig. 6 ON-state Voltage vs.
Ambient Temperature
50
40
30
20
100
50
40
30
10
10
20
30
40 50
Forward current I F ( mA )
100
20
10
20
30
40 50
Forward current I F ( mA )
100
S16MD01/S16MD02/S26MD01/S26MD02
Fig.12 Zero-cross Voltage vs.
Ambient Temperature
(S16MD02/S26MD02 )
Fig.11 Turn-on Time vs. Forward Current
(S16MD02/S26MD02 )
20
Load : R
I F = 15mA
Zero-cross voltage VOX ( V )
Turn-on time t on ( µ s )
VD = 6V
RL= 100Ω
T a = 25˚C
10
5
4
25
20
3
2
10
20
30
40 50
Forward current I F ( mA )
15
- 30
100
0
20
40
60
80
Ambient temperature T a ( ˚C )
■ Basic Operation Circuit
R1
2
+ VCC
D1
ZS
SSR
3
Load
8
AC 100V (S16MD01/S16MD02)
AC 200V (S26MD01/S26MD02)
6
VI
ZS : Surge absorption circuit
Tr1
( 1 ) DC Drive
( 2 ) Pulse Drive
( 3 ) Phase Control
AC supply voltage
Input signal
Load current
( for resistance load)
Notes 1 ) If large amount of surge is loaded onto V CC or the driver circuit, add a diode D 1 between terminal 2
and 3 to prevent reverse bias from being applied to the infrared LED.
2 ) Be sure to install a surge absorption circuit.
An appropriate circuit must be chosen according to the load ( for CR, choose its constant ) . This must be
carefully done especially for an inductive load.
3 ) For phase control, adjust such that the load current immediately after the input signal is applied will be
more than 30mA.
■ Precautions for Use
1 ) All pins must be soldered since they are also used as heat sinks ( heat radiation fins) . In
designing, consider the heat radiation from the mounted SSR.
2 ) For higher radiation efficiency that allows wider thermal margin, secure a wider round
pattern for Pin No.8 when designing mounting pattern. The rounded part of Pin No.5 ( gate )
must be as small as possible. Pulling the gate pattern around increases the change of being
affected by external noise.
3 ) As for other general cautions, refer to the chapter“Precautions for Use”
100
Application Circuits
NOTICE
●The circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
●Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
●Observe the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
●Contact a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
●If the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
●This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
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permission of SHARP. Express written permission is also required before any use of this publication
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●Contact and consult with a SHARP representative if there are any questions about the contents of this
publication.
115